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Modbus-Duct-Immersion

ACI BN Series BACnet MS/TP and Modbus RTU Duct and Immersion Temperature Sensors

  • Native BACnet MS/TP and Modbus RTU communication
  • Suitable for duct and immersion temperature monitoring
  • Conformally coated electronics for long-term reliability
  • Easy-access enclosure with configurable DIP switches
Modbus-Duct-Immersion
From $ 249.00
ACI BN Series BACnet MS/TP and Modbus RTU Duct and Immersion Temperature Sensors Modbus-Duct-Immersion Modbus-Duct-Immersion
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Product Overview
  • Construction Details Foam Material: Neoprene/EPDM/SBR Polymer, Foam Material Rating: UL94-HBF; FMVSS-302; MIL-R-6130C
  • Data Format 8 data bits: field selectable parity : field selectable stop bits
  • Data Interface BACnet™ MS/TP,Modbus RTU,EIA RS-485
  • Display Measuring Units °C, °F
  • Electrical Connection Screw Terminal
  • Enclosure Color Black
  • Enclosure Material ABS Plastic
  • Enclosure Ratings UL94-HB
  • Enclosure Temperature, Max 90 °C
  • Enclosure Temperature, Min -30 °C
  • LED Indicators Tri-color LED for Connection Status
  • Load Resistance 120 Ohms Termination Resistance (Field Selectable)
  • Operating Distance, Max 4000 ft
  • Operating Humidity 10 to 95% RH, non-condensing
  • Operating Temperature, Max 80 °C
  • Operating Temperature, Min -40 °C
  • Probe Diameter 0.25 in
  • Process Connection Size 1/2 in
  • Process Connection Type NPT Male
  • Resolution +/- 0.1º
  • Sensor Material 304 Stainless Steel
  • Series ID Modbus-Duct-Immersion
  • Storage Temperature, Max 85 °C
  • Storage Temperature, Min -40 °C
  • Supply Current 25 mA, Max
  • Supply Voltage 12 to 36 Vdc, 24 Vac
  • Temperature Accuracy +/- 1.0 ºF (+/- 0.5 ºC)
  • Temperature Measurement Range -30 to 85 ºC
  • Update Rate 4 seconds
  • Wire Gauge 22 to 16 AWG
ACI BN Series Duct and Immersion Temperature Sensors provide native BACnet MS/TP and Modbus RTU communication for accurate temperature monitoring. Featuring conformally coated electronics, easy configuration, and flexible installation options for HVAC and process applications.
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