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HBM-M-Rosette
Rosette Strain Gauges for High Temps & Alternating Load Resistance
- High Resistance to Alternating Loads
- High Temperature Range 300°C (572°F)
- Wide Spectrum of Different Types
- All models sold in a 5-pack, except 1-LM11 which are sold in a 10-pack
HBM-M-Rosette
From
£
401.80
Product Overview
- Bend Radius, Min 5 mm
- Carrier Thickness 35 μm
- Electrical Connection Solder Pads
- Elongation 10000 µm to 15000 µm
- Encapsulation Thickness 25 μm
- Gauge Factor 2.2
- Grid Style 3 Grid Rosettes
- Grid Thickness 5 μm
- Lead Length 0 m
- Material Expansion Compensation N/A
- Materials Chromium-Nickel, Polyimide, Glass Fiber Reinforced Phenolic
- Mechanical Life 10⁷ cycles
- Mechanical Life Note 10⁷ cycles at 2000 um/m,10⁶ cycles at 2200 um/m, 10⁴ cycles at 3100 um/m
- Nominal Resistance 350 Ω
- Operating Temperature, Max 300 °C
- Operating Temperature, Min -200 °C
- Pack Size 5
- Resistance Tolerance ±0.3%
- Series ID HBM-M-Rosette
- Strain, Max 10,000 µm
Supported Applications
The Omega HBM M Series consists of encapsulated foil strain gages designed for high resistance to alternating loads and operation at elevated temperatures up to 300°C (572°F). These sensors are suitable for testing high-strength materials, including fiber composites. The series supports various measurement geometries required for specific stress states: linear strain in one direction; tension and compression via T rosettes with grids offset by 90°; shear stresses using V-shaped gages arranged at ±45° to the axis; and biaxial stress states with unknown principal stress directions using rectangular or stacked rosette configurations.
Operating Conditions & Performance
The HBM M Series operates within a temperature range of -200 to 300°C (-328 to 662°F). The sensors feature a CrNi (nickel-chromium) alloy foil grid with an approximate gage factor of 2.2, specified on each package. Resistance tolerance is ±0.3%, while gage factor tolerance varies by size: ±1.5% for grid lengths less than 3 mm and ±0.7% for grid lengths greater than or equal to 3 mm.
Performance limits include a maximum positive elongation of 10,000 μm (1%) and a negative direction limit of 15,000 μm (-1.5%). Fatigue life data indicates performance up to 10⁷ cycles at 2000 μm/m, 10⁶ cycles at 2200 μm/m, and 10⁴ cycles at 3100 μm/m when tested to failure.
Configuration Options
The series is available in multiple geometries (LM1, TM1, TM9, XM4, RM8, RM9) with measuring grid lengths of 1.5 mm (0.06"), 3 mm (0.12"), and 6 mm (0.24"). Nominal resistance options are 350 Ω or 1000 Ω.
Key construction features include:
- Carrier Material: Glass fiber reinforced phenolic, with a thickness of 35 ±10 μm.
- Encapsulation: Polyimide film, 25 ±5 μm thick.
- Electrical Connection: Solder pads with strain relief.
The series supports specific bonding materials: Z70 (rapid adhesive) or EP310S (high temperature two-component epoxy resin). Accessories include 1-BCY01 accelerator for the rapid adhesive and cleaning solvents such as 1-RMS1 or its spray version, 1-RMS1-SPRAY.
Maximum permitted effective excitation voltage varies by model geometry and grid length, ranging from 5.3 V to 22 V depending on the specific configuration (specified per model).
Key Product Differences
The HBM M Series distinguishes between linear gages and rosette configurations based on measurement requirements:
- LM1: Linear strain gage with one measurement grid.
- TM1 & TM9: T rosettes (single or stacked) measuring tension and compression with grids offset by 90°.
- XM4: V-shaped strain gage for shear stress determination.
- RM8 & RM9: Rectangular or stacked rosette configurations with three measurement grids at 0°, 45°, and 90° for biaxial stress states.
Packaging varies by model: all models are sold in a 5-pack, except the LM1 series which is sold in a 10-pack. Minimum bending radius requirements differ between linear gages (5 mm / 0.20") and stacked rosettes (10 mm / 0.39").
PDFs & Manuals