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OB-OMEGABOND-AIR-SET
Air Set High Temperature Cements
- Thermally Conductive
- Thermal Shock Resistant
- Electrically Insulating
- Resists Oils, Solvents, Most Acids
OB-OMEGABOND-AIR-SET
From
TWD
2,642
Product Overview
- Dielectric Strength Note Dielectric Strength at 20°C:12.5 to 51.0 V/mil;Dielectric Strength at 400°C: ≤15 V/mil;Dielectric Strength at 795°C: ≤1.3 V/mil
- Series ID OB-OMEGABOND-AIR-SET
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*.
SELECTION CRITERIA FOR CEMENTS
1. Type of Application † “ Potting, sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement should be used.
2. Thermal Considerations † “ What is the maximum temperature that the cement must withstand? What degree of thermal conductivity is needed? What degree of thermal expansion is allowed? These parameters are then matched to the appropriate cement.
3. Substrate † “ What materials will the cement be in contact with?
4. Application Considerations † “ Pot life, set time, method of dispensing, batch size, cure procedure.
5. Miscellaneous Considerations † “ Porosity, moisture absorption, electrical resistance, volume stability, clearances/tolerances.
SELECTION CRITERIA FOR CEMENTS
1. Type of Application † “ Potting, sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement should be used.
2. Thermal Considerations † “ What is the maximum temperature that the cement must withstand? What degree of thermal conductivity is needed? What degree of thermal expansion is allowed? These parameters are then matched to the appropriate cement.
3. Substrate † “ What materials will the cement be in contact with?
4. Application Considerations † “ Pot life, set time, method of dispensing, batch size, cure procedure.
5. Miscellaneous Considerations † “ Porosity, moisture absorption, electrical resistance, volume stability, clearances/tolerances.
PDFs & Manuals